Summit Attends 2017 IPC Reliability Forum

Summit Attends 2017 IPC Reliability Forum

IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.

Event Background

The event steering committee charged with developing the forum was headed by Program Chair Michael Carano, and included Don Dupriest, Michael Jawitz, Craig Hillman, Gary Ferrari, Jack Fisher, Denny Fritz, and Sanjay Huprikar, VP of the IPC Member Services. Mike Carano, VP of RPB Chemical Technologies served as the forum’s ringleader, host and emcee. I was fortunate enough to have been asked to participate and speak at the event, and I feel an obligation to let those who were not able to attend this year know what an invaluable educational opportunity this ongoing forum presents for our industry moving forward.

观众

该论坛的出席非常好,具有真正的谁是我们行业供应链的谁,包括原料和设备供应商,PCB制造商,合同制造商和OEM。Companies represented included: Amphenol, Atotech, Aurora Circuits, CTS, DfR Solutions, Dow Chemical, Dow Electronic Material, DuPont–RTP, Embraer S.A., Extreme Engineering Solutions, FTG Circuits, HDP User Group International, Holaday Circuits, Intrinsiq Materials, Inventec Performance Chemicals, IPC, KEMET Electronics, Lockheed Martin Space Systems, Lockheed Missiles and Fire Control, MacDermid Enthone, MEDEL, Minco, Motorola, Nexteer Automotive, Northrop Grumman, NSWC Crane, NTS, Orbital, Park Electrochemical, Penn State University, Precision Analytical Laboratory, Prismview, Raytheon, RBP Chemical Technology, Rockwell Collins, Rolls- Royce, SAIC, Summit Interconnect, The Right Approach Consulting, ThingWeaver Solutions, TTM Technologies, Ventec, and ZESTRON.

主题

指导委员会在组装了与论坛制造高性能产品的主题相关的主题阵容的精彩工作,并从我们的行业最聪明的技术思想中展示了洞察力。以下是每个扬声器演讲的简要高光。

主题演示:是什么让我们的组织成为全球领导者

Phil Titterton, President of the Aerospace & Defense/Specialty Business Unit with TTM, presented tools, techniques and lessons learned on what it takes to be a successful PCB fabricator in today’s global environment. Phil discussed the importance of DFM and its impact on reliability and the need to share best practices with- in our industry. Phil’s advice to “park the ego at the door” was particularly telling as he explained that collective minds versus islands is critical to solving discrete problems and stream- lining processes. This really resonated with me as some companies still believe that the key to success is to protect their trade secrets. There really are very little secrets; the key to success is in the execution!

Building Reliability In: Design for Reliability

FTG技术支持总监Gary Ferrari提出了各种影响可靠性的问题,例如生命周期开发和材料,施工,故障模式的考虑,以及表面光洁度的影响以及通过填充材料的可靠性。一个加里的关键外来的外带是,性能可能相同可靠性,但可靠性绝对等于性能。Gary在生命周期发展中展示了四步过程:1)确定可靠性要求;2)识别生命环境;3)识别存储环境;和

  • Analyze and selection of components, materials, processes and strategies. A key portion of his presentation dealt with typical microvia failure modes and how to avoid
使用IPC-2581捕获和传输设计数据的通用协议

Gary Carter是ThoneWeaver解决方案的主体,提出了在供应链中所有有关各方之间的产品开发中合作的重要性。Gary强调了仅仅依靠Gerber数据依赖的危险,并专注于采用智能数据传输,以提高PCB设计,制造和制造组件的效率和质量。yabo16 app他介绍了案例研究结果和“智能PCB数字工厂”解决方案,寻求通过用IPC-2581B替换工程文件的“购物车”来消除电子设计,制造和测试过程中存在的低效率。

Reliable Use of Embedded Passives

Jimmy Baccam, senior electromechanical designer for Lockheed Martin, educated us on what embedded planar capacitance is and is not, along with the pros and cons of this technology. Jimmy continued with lessons learned from fabricating with thin dielectrics, thermal stress and shock testing. A great deal of technical information was shared on the benefits of “being thin” and understanding power distribution.

How Fabrication Affects Reliability— Flowing Reliability from Design to Fabrication & Targeting a Precise Defect with Data: Reliability Report on WRAP for Plated Through-Holes

Hareep Heer,VP和CTO与FTG,在两个主题影响PCB可靠性的主题上,首先关注设计和制造之间的关系。Hardeep开始审查所有市场部门的当前可接受性标准,包括生命周期预期和失败利率。他讨论了可靠性测试,包括热循环和IST测试以及可以实现的相关结果和数据。一个特别的信息部分是他对典型的PCB故障以及影响可靠性的过程和材料的审查。Hardeep的第二个演示讨论了包装电镀,其被定义为“从电镀通过结构连续地延伸到表面上的电解孔镀层。”Hardep介绍了FTG和PWB互连之间的关节DOE的策略,研究了包装电镀的故障模式。计划是在今年晚些时候完成DOE,并在2018年IPC APEX博览会会议上向业界展示业务。

军事要求可靠性

IPC Hall of Famer Dennis Fritz and Jeff Harms, Reliability & Maintainability Engineering with the Naval Surface Warfare Center, were up next. They presented an overview of military requirements that have an impact on product reliability, with a focus on environmental conditions. They reviewed the requirements of the military standards SD-15, Performance Specification Guide and MIL-STD- 810, Department of Defense Test Method Standard. Several test methods were reviewed that are used to evaluate a product’s capability to withstand environmental exposure, and concluded by providing a list of resources available to military contractors and suppliers.

Collision of Quality and Reliability Requirements

丹尼斯·弗里茨审查了质量和可靠性之间协同作用的思想宣传,以及与设计相关的影响。yabo16 appDennis呈现了几个关键定义,因为它与这种互动有关:

  • 可靠性:功能的能力期待 -在下面expectedoperating conditions, for anexpected期间,不超过expected失败
  • Quality: the ability to produce the product, in the manner specified by the customer in the documentation package provided, including any test or legal

A review of the traditional evaluation methods was discussed, followed by an examination of both the strengths and shortcomings of traditional methods. Dennis discussed the reliability challenges of today’s technology, including component miniaturization, additional assembly thermal cycles, lead-free temperature requirements, and the increased stresses placed on laminates. He concluded that while traditional PWB quality measurements are still necessary to keep fabrication processes in control, development of new measurements is needed to assure reliability of advanced technology.

Physics of Failure

Craig Hillman,Ph.D.CFR解决方案的首席执行官和管理合伙人,介绍了IPC委员会的工作,了解有必要开发用于失败(POF)要求的物理学的建模和仿真。Craig引用了OEM的兴趣,正在推动供应链来执行这些类型的分析,并且该行业在这些领域普遍缺乏数据。克雷格定义了他说的问题的范围,“当产品卷容易进入数百万个单位时,即使是0.1%的失败率问题也是一个大问题。”当他介绍OEMS“讨厌”环境测试的原因时,包括:花费太多,成本太高,在此过程中的成本太晚了,供应商很少失败,失败并不总是相关的,而且失败并不总是相关的,而且对失败意味着有重大分歧。

委员会工作范围是在电子供应链中识别实际实施物理性能分析物理学要求的最佳实践,专注于元件和组装技术。CRAIG来自一名主要PCB制造商的评论,他说,“必须制定并实施新的,前期建模方法,以增加快速发现和纠正设计中的问题,以避免潜在的现场问题,降低保修费用,并提高客户满意度。“委员会的目标是审查当前的20多项标准,并利用适当的属性来制定新标准,以满足行业的现有预期。

QFN焊点中的空隙:我们应该如何使用什么来实现最大的空白标准?

Dave Hillman,主材料和流程工程师与Rockwell Collins,在焊接接头释放中的空隙中的影响下。戴夫开始审查包装趋势,包括成本,低调,电气性能和热耗散。然后,他继续审查对焊接联合性能的设计影响,包括装配影响,例如焊膏选择和回流型材。坦率的讨论遵循关于可接受的空缺的“功能含糊不清”指导,以及制定基于行业数据的新可接受性标准的决定,该标准是利用美国宇航局国防部联盟团队完成的工业数据。戴夫审查了开发的测试车辆和组件,热型材和测试协议,并进行了可靠性测试的结果。从数据到达的结论是有趣的,建议焊接联合可靠性不是问题,而是组成功能完整性。Dave通过说明解决方案是强调组件选择和生产性,解决了热传输或电接地特性的功能要求。

行业财团工作:协作项目如何帮助您的组织

Jack Fisher,高密度包装用户组(HDPUG)的项目促进员接下来的可靠性评估的协同方法。HDPUG是一个项目导向的行业联盟,解决了新电子元件包装和互连技术的集成到会员公司供应链中。他们的使命是推动电子行业的创新,拥有超过50家的电子行业公司参与该集团。杰克审查了几个当前项目的地位:由柯蒂斯赖特伊万斯特拉兹基克利特的多层叠片,以及由思科的Brice Achkir和M.患有TTM的M. Immonen的光学接口II项目。Jack通过Mike Bixenman的Kyzen Corpman领导的最近封闭的电化化学迁移项目的结果结束了,在每个项目中都有重要的数据,信息和结果。

Mitigation of Pure Tin Risk by Tin-Lead SMT

David Pinsky,高级研究员与RAYTHEON公司审查了行业循环学习的结果,纯锡成品终端的型号有风险,须晶须增长和潜在的不可靠性。该研究的目标是评估典型的SMT成分将实现自我缓解的条件,并且开发了一种母鹿。考虑许多潜在因素被认为是包含在该研究中,并且选择的四个因子为1)组分包装(16个P / NS);2)董事会完成(OSP&SNPB HASL);3)垫尺寸;和4)制造过程。David审查了DOE细节,数据和结果,包括新董事会(6-13个月)和旧董事会(> 5岁)的结果。大卫介绍了DOE的结论,其中包括1)领先的底域将比领先的上侧更频繁地减轻;2)通过流程调整提高自我缓解的机会;3)在正常保质期之外的零件不能以与正常保质期内的零件相同的方式自行缓解。

ENEPIG—Impact of Surface Finishes and No-clean Fluxes

比尔。福克斯、材料和过程协会。工程师with Lockheed Martin Company present- ed on the reliability of ENEPIG in small solder joints. The premise of Bill’s discussion was that HDI drives finer features on the printed board, and as solder joints become smaller, HASL be- comes problematic. Electroless Nickel/Electro- less Palladium/Immersion Gold (ENEPIG) is a surface finish that has been demonstrated to have a variety of benefits, however, there are concerns that palladium above a certain thickness or content has an adverse effect on the solder joint. Bill reviewed the specifics and results of a number of experimental procedures that were developed to test for a number of conditions. The conclusions noted were 1) No noticeable extent of PdSn4 intermetallics in joints due to the lower Pd thickness of the ENEPIG specifi- cation; 2) Solder joints on ENEPIG demonstrated good shear strength and comparable thermal cycling survivability to HASL; and 3) Pd content from a standard ENEPIG finish is acceptable for high reliability in small solder joints (1.5−2.5 mil). Bill ended by calling for additional discussions on two points: 1) Material and process details such as gold thickness, solder mask thickness, and solder volume are critical factors to very small solder joints, and 2) Gold at 3% in a solder joint may have been a factor in crack initiation, but thermal cycle failures are in the bulk solder joint.

现在是改善组件标准和测量的时候了

Joe Russeau, president of Precision Analytical Laboratory, asked the rhetorical question “should the industry care about component cleanliness?” and presented the results of a study by the ad hoc Cleanliness Team. The team member companies included IEC Electronics, Corfin Industries, Secure Components and Precision Analytical Laboratory, and focused on understanding the impact of component cleanliness on reliability. The team has completed the first two of the four phases of the study: Phase I—Printed Circuit Board (PCB) Cleanliness; Phase II—Component Cleanliness; Phase III—Printed Circuit Board Assembly (PCBA) Cleanliness; Phase IV—Reliability Cleanliness Limits.

Joe’s call to action was to continue the dialog in the industry on the following topics:

  • 现在是提高组件清洁度标准和测量的时候了
    • Start the discussion (Why should industry care?)
    • “清洁”是什么意思?
  • 目前用于测量离子的“清洁”的行业技术是什么?溶剂提取物的电阻率(R.O.S.E)
    • 离子色谱
    • GEIA-STD-0006, Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
    • 数据比较研究(R.O.S.E. VS. IC)
  • 我们从哪里开始?
关于测试的新透视

William Graver, senior analyst with National Technical Systems (formerly Trace Laboratories), presented the thought-provoking question, “Is test an unnecessary evil, or a life-saving necessity?” William walked through a number of major reliability concerns in today’s environment, and presented some graphic examples of catastrophic reliability failures. Two major failure modes were reviewed in the form of case studies. The first study was on via-pad separation in rigid-flex PCBs, which exhibited a 25% failure rate after two assembly thermal excursions. This was attributed to microetch chemical type, and size of the micro-via. The second study was on plating separation, which also had high failure rates after two assembly reflow cycles. The solutions to this issue were to replace button plating with pattern plate, and to use a thicker wrap plate per IPC Class 3. William concluded by reviewing methods for testing to eliminate failure mode:Figure 10: Yours truly presenting.

  • 5X回流仿真
  • Interconnect stress testing (IST)
  • New thermal cycle method—CITC
  • -100°C vacuum environment
  • Extra DPA
检查:是否有必要?

我为这一活动进行了响应,并在托尼前一天收到了一些反馈,这是一个与我的客户之一的优质工程师同事。yabo16 app在阅读我送出的白皮书的第一段之后,托尼告诉我:“史蒂夫,你错了。你永远不能摆脱我们业务的所有检查;这是不可能的。“I said: “You’re right, Tony, but when I send you the entire paper you will see that I am talking about eliminating the profit- sucking practice of using inspection as a Band- Aid to quality problems instead of fixing the process.”

我讨论了客户通过废料,返工和退货支付我们效率低效的流程的指​​出,这膝关节反应对利润有三重影响:

  1. Inspection by definition is a non- value-add reactive process
  2. It doesn’t address the root cause of the issue and assures it will resurface at some point
  3. Inspection is not effective

解决方案是在您的操作中采用适当的最佳实践工具,并审查了许多精益的方法,工具和技术。Mikel J. Harry的研究结果,博士(6秒字节的父亲)为观众提供了思想的食物。哈利博士对美国制造业公司进行了基准研究,发现美国的平均Σ水平在3.5至4秒之间。这意味着平均公司花费了25%的收入,以质量差(COPQ)。yabo16 app并记住谁在为此付出代价:您的客户。所以,无论您如何思考(或告诉您的客户),您都是,有足够的改进空间。我以一个卓越的统计数据结束:

愚蠢地试图通过分拣“质量检查”对利润的影响更大:yabo16 app

  • Raising prices on your product
  • Hammering your suppliers for lower costs
  • Most any other traditional profit enhancement initiatives
结论

在我们的行业中非常需要这些类型的事件,并对我们仍然始终处于支持客户的最前沿。我期待看到可靠性论坛获得势头,因为它成为一年一度必须参加行业活动。当我向Sanjay向开发此次活动的动机提出Sanjay Huprikar

“电子行业存在实际紧迫性,以提高可靠性的实用方法,以提高可靠性和今年的IPC释放能力论坛,重点是长期可靠性的过程和配合。From the keynote presentation that provided an insider’s perspective on the how product reliability is important for good business to the presentations on de- sign for reliability, collision of quality and re- liability requirements, the physics of failure, military requirements for reliability, and more, the event provided attendees with new strategies they were able to take back and implement right away.”PCB.

通过:Steve Williams - I-Connect007 -Review of the 2017 IPC Reliability Forum

PCB杂志•2017年7月

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